Department of Mechanical EngineeringNEWS & EVENTS
23 Apr 2012
Prof Ricky Lee received an Outstanding Paper Award from ICEP
An Outstanding Paper Award was bestowed to Prof. Ricky Lee on 18th April at Tokyo during the award ceremony of 12th International Conference on Electronics Packaging (ICEP2012). The winning paper is entitled "Investigation of PWB Laminate Resin and Its Relation with the Pad Cratering Resistance", which was presented by Prof. Lee in ICEP2011 last year. The co-authors of this paper are Prof. Lee's PhD student, Mr. Chaoran Yang, and Postdoctoral Fellow, Dr. Fubin Song.