Conference scope 

Major topics of ICFF VIII include theory, modelling, calculations, simulations, and experiments in:

·  Fracture, creep, and fatigue at the atomistic, mesoscopic, and macroscopic scales,

·  Fracture, creep, and fatigue of engineering materials and structures,

·  Fracture, creep, and fatigue of smart materials and structures,

·  Fracture, creep, and fatigue of biomaterials,

·  Environment effects,

·  Fracture, creep, and fatigue under mechanical, thermal, electrical, and/or magnetic loading,

·  Reliability and failure analysis of electronic devices and electronic packaging,

·  Dynamic fracture,

·  Multiscale fracture mechanics.

Abstracts

An electronic form (MS-Word format) of two-page extended abstract with title, name, address, phone/fax numbers and E-mail address should be submitted to icff8@ust.hk by 15 October 2007. Accepted abstracts will be published in an abstract booklet.

Posters

The scientific exchanges will be achieved through oral and poster presentations. Presentation form (oral or poster) for each accepted abstract will be informed by 31 October, 2007 with instructions for poster format. The poster contest will be held on 6 January 2008. Excellent posters will be recognized by Poster Awards.

Papers

All delegates are encouraged to submit full manuscripts for publication in special issues of two international journals (International Journal of Fracture and Engineering Fracture Mechanics). The format of the papers should follow the instructions of the journals. You may go to their websites for details. The deadline for paper submission to icff8@ust.hk is 7 January 2008.

Relevant Links

Important Dates

Abstract/Paper Submission

Poster Session