Course summary:
Microfabrication technology: bulk micromachining; surface micromachining: film deposition, chemical and plasma etching,
DRIE; wafer bonding; surface treatment for bio-compatibility; application in accelerometers, pressure sensors,
micromirrors and microfluidic devices; nano-fabrication.
Prerequisites: MECH 595 Introduction to Microsystem Technology or equivalent (such as Introduction to CMOS Device Fabrication)
Lecturer: Dr. Yi-Kuen Lee, E-mail: meyklee@ust.hk
Tel: 2358-8663, Rm 2563,
Office hour:
Lectures schedule:
Reference textbook:
Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed., Marc Madou, CRC Press (TK7836 .M33, HKUST LIB)
ISBN: 0849308267, 2002.
buy from online bookstore or
Asia Publishers Services LTD,
25% - Mid term exam
40% - Term project
10% - Class attendance and participation
25% - Homework. No numerical credit given if late. However, it is most important that
you turn it in, even if late. You are expected to do your own work.
Important Dates:
13 Oct 2005 (Thur): Midterm
3 Nov 2005: Project proposal due
15 Dec 2005 (Thur):
Final Project Presentation + Final Projec Report, Venue: Rm 2465,
Time:
Final
Project Presnetation Schedule
Related courses:
MECH595 Introduction to Microsystem Technology
ELEC 507 Microelectronics Fabrication Technology
ELEC 508 Integrated Circuit Fabrication Laboratory
Please respect your classmates and others by turning off your pagers and mobile phones during the class.
1 Introduction to Microsystem Technology (MEMS), NHK Nanospace video
2 Photolithography and Layout, ASME Video: MEMS: Cases Studies of Commercial Products, 1996
3 Thin film formation: dry and wet oxidation
4 Thin film formation: LPCVD (polysilicon, low stress nitride, PSG), PECVD
5 Thin film formation: e-beam evaporation and sputtering
6 Impurity Doping: diffusion and ion implantation
7 Wet etching: isotropic and anistropic (KOH, EDP, TMAH)
8 Dry etching: plasma etching, reactive ion etching (RIE) and Deep RIE for high-aspect-ratio silicon
etching
9 Wafer bonding: fusion bonding, anodic bonding, eutectic bonding, Nov 8
10 Microfabrication CAD, TBA
11 Microfabrication processes for accelerometers and pressure sensors, Nov 15
12 Microfabrication processes for digital micromirrors,
13 Microfabrication processes for microchannel and other microfluidic devices
14 Introduction to Nanotecnology and NEMS
15 Term project presentation
Homework#3: due 7 Oct
2005 New!
Lecture Notes: (PDF files may need Adobe Reader 5.0
or above)
Fabrication
of Thick Silicon Dioxide Layers Using DRIE, Oxidation and Trench Refill, Zhang,
C. and Najafi, K., IEEE MEMS 2002, pp.160-163.
Lec 2 slides, Extra slides
in Lec 2 for microfab
For ref
only: Sigmund, P., Theory of
Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets,
Phys. Rev.Vol.184, No.2,
pp.383-416, 1969.
Piezoresistance
Effect in Germanium and Silicon, Phys. Rev. Vol. 94, No. 1, pp.42–49, 1954.
Piezoresistance
effect of silicon, Kanda, Y., Sensors and Actuators A, Vol. 28, pp.83-91, 1991.
Piezoresitive
AFM probe, Harley, J.A., Stanford PhD dissertation, 2000.
Etching
selectivity table, from Micromachine
and Micromechtronics, Esashi, M. et al., Baifukan Co., Japan, 1992.
Etching
table, Kirt Williams,1996
Etch
rate for micromachining processing, William, K.R., J. MEMS, Vol.5, No. 4,
pp.256-269, 1996
Nanopillar by Ion implantation
and TMAH etching, IEDM 2002
Lec 7 Dry Etch
slides Review slides
9. Lec 8
slides
MEMS
Bonding review paper: Proceeding of IEEE, Vol.86, No.8 pp.1575-85, 1998.
Micromachined
Inertia Sensors, Proceedings of the IEEE, Vol.86, No.8, pp.1640-1659, 1998.
Overview
of Automotive Sensors, IEEE Sensors Journal, Vol.1, No.4, pp.296-308, 2001.
Laterally
driven polysilicon resonant microstructures, IEEE MEMS, pp. 53-59, 1989
Analog Device ADXL05
microaccelerometer datasheet. Analog
Device website
Murata
Piezoelectric micro vibrating gyroscope datasheet.
An Integrated
Microelectromechanical Resonant Output Gyroscope, IEEE MEMS 2002.
A MEMS-based
projection display, Proceeding of the IEEE, Vol. 86, No. 8, pp.1687-1704, 1998.
Biosensor review paper 1: Yang, M., et
al, Genosensor technology and the detection of interfacial nucleic acid
chemistry, Analytica Chimica
Acta, Vol.346, pp.259-275, 1997.
Biosensor review paper 2: Ivnitski, D., et al., Biosensors for
detection of pathogenic bacteria, Biosensors & Bioelectronics, Vol. 14,
DNA microarry (PGA)+DMD+microfluidics : Xeotron Inc., Houston, Texas
Nanotopia video script
(HKUST Library: TA418.9.N35
N36, BBC, 1998)
H.G. Craighead, Nanoelectromechanical System, Science, Vol. 290, pp. 1532-1535, 2000.
CPU Breakthrough: Chips Enter the
Nano-Age, Extreme Tech, Sep 13, 2002
http://www.extremetech.com/article2/0,3973,533496,00.asp
SUPREM 4 developed by Stanford, free Microfabrication
process simulation program in Window 2000
(http://www.me.ust.hk/~mech597/note/suprem.zip )
Online semiconductor glossary
Companies involved in MEMS products in the worlds
http://www.me.ust.hk/~mech597/mech597_mems_com.html
ME 219 Microelectromechanical Systems, Spring 2002
EE 245/ME C218
Introduction to MEMS Design, Fall 2002
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