MESF 595 Introductions of Microsystem: Technology and Devices
Course Description:
Physics of Scaling; energy transduction, sensing and actuation
principles; micro-fabrication technology and technology fundamentals; film
formation, photolithography and etching; integrated Microsystems and
Microsystems packaging.
Exclusion: MECH 595
Instructor:
Dr Yi-Kuen Lee
Department of Mechanical Engineering, HKUST
Tel: 2358-8663, E-mail: meyklee@ust.hk
Textbook:
Microelectromechanical Systems: Advanced Materials and Fabrication
Methods, The National Academies Press,
Grading Policy:
Homework: 15%
Class attendance and participation: 5%
Mid-term exam: 30%, Date: 18 April 2007,
Venue: Rm 2407 (2/F, Lift 27-28)
Final Term Project:
50%
Date: 30 May 2007, Time: 6:30pm-9:50pm, Venue: Rm
2504 (2/F, Lift 27-28)
Description of the MESF 595 term project
Final
Term Project Presentation Schedule
All the MESF 595
Project files, zipped New!!!
Lecture Time & Venue: 7:00pm-10:00pm,
Wednesday, Rm 2504 (2/F, Lift 25/26)
Outline of Lecture:
1. 31/1/07 MESF595_1
2. 07/2/07 MESF595_2
K. Peterson, Silicon as
Mechanical Material, Proceedings
of the IEEE, 70(5), 402-457, 1982.
K. Petersen, “A New Age for MEMS”,
IEEE Transducers’05,
H. Fujita, “A decade of
MEMS and its future,” IEEE MEMS’97,
3. 14/2/07 MESF595_3
W. S. N. Trimmer,
“Microrobots & micromechanical systems,” Sensors &
Actuators,19(3),1989,
267-287,1989.
C-J Kim ,et al, “Comparative evaluation
of drying techniques for surface micromachining,” Sensors
and Actuators A, 64(1)
17-26, 1998
Morini, Int. J. of
Thermal Sci. Vo. 43, 631, 2004 (review)
Bousse, L., et al,,
Annu. Rev. Biophys. Biomol. Struct., 29, 155-181, 2000.
G. Beni and S. Hackwood,
Appl. Phys. Lett. 38, 4, pp.207-209, 1981
4. 28/2/07 MESF595_4
J. Bryzek, K. Peterson,
Vol. 31, No.5, pp.20-31, May 1994.
R.T. Howe, R.S. Muller,
K.J. Gabriel and W.S.N. Trimmer, “Silicon Micromechanics: Sensors and
Actuators on a Chip,”
IEEE Spectrum, Vol. 27, No. 7,
pp.29-31, 34-35, Jul. 1990.
Piezoresistance Effect
in Germanium and Silicon, Phys. Rev. Vol. 94, No. 1, pp.42–49, 1954.
Introduction
to Sensors, pp. 9-18, Expanding
the Vision of Sensors Materials (Chap 1), National
Academy Press,
5. 7/3/07 MESF595_5
S.C. Gong and C.
Lee, Analytical Solutions of
Sensitivity for Pressure Microsensors, IEEE Sensor
Journal, Vol. 1,
No. 4, 340-344, 2001.
S.-C. Kim and K.D.
Wise, “Temperature Sensitivity in Silicon Piezoresistive Pressure Transduers,”
IEEE Trans. on
Electron Device, vol. ED-30, No. 7, pp.802-810, 1983.
K. Suzuki, et al,
“Nonlinear Analysis on CMOS Integrated Silicon Pressure Sensor, IEEE IEDM,
pp.137-140, 1985.
H. Tanigawa, T.
Ishihara, M. Hirata and K. Suzuki, “MOS Integrated Silicon Pressure Sensor,”
IEEE Trans. of
Electron Devices, vol. ED-32, No. 7, pp.1191-1195, 1985.
C.D. Fung and W.H. Ko, Miniature
Capacitve Pressure Transducers, Sensors and Actuators, Vol. 2,
pp.321-326, 1982.
C.S. Sander, J.W.
Knutti and J.D. Meindl, A Monolithic Capacitive Pressure Transducers with
Pulse-Period Output, IEEE Trans. on
Electron Devices, Vol. ED-17, No. 5, pp.927-930, 1980.
M.J.S. Smith, et
al., “A Micropower IC for a Biomedical Pressure Transducer,” Intl Conf on
Solid-
State Sensors and
Actuators (Transducers’85),
S.B. Cray, et al,
“Digital Compensation of High-Performance Silicon Pressure Transducers,
“Sensors and
Actuators, Vol. A21,pp. 70-72, Feb, 1990.
6. 14/3/07 MESF595_6_
7. 21/3/07 MESF595_7 MESF595_7-2_
K. Peterson, Silicon as Mechanical
Material, Proceedings
of the IEEE, 70(5), 402-457, 1982.
8. 28/3/07 MESF595_8
9. 18/4/07 Midterm Exam
10. 25/4/07 MESF595_9
11. 02/5/07 MESF595_10
T.-H. Wang et al., A Zepto Mole DNA
Micro Sensor, IEEE-MEMS, 431-434, 2001
F.-G. Tseng et al.,
A Monolithic, High Frequency Response, High-Resolution Microinjector
array Ejecting Sub
Pico-liter Droplets without Satellite Drops – Part I: Concepts, Designs and
Molding,” Journal of
MEMS, 11(5), 427-436, Oct, 2002.
F.-G. Tseng et al., A
Monolithic, High Frequency Response, High-Resolution Microinjector
array Ejecting Sub Pico-liter
Droplets without Satellite Drops – – Part II: Fabrication,
Characterization and Performance Comparison,” Journal
of MEMS, 11(5), 437-447, 2002.
M. Masahara et al. “Ultrathin
channel vertical DG MOSFET fabricated by using ion-
bombardment-retarded
etching,” IEEE Transactions on Electron Devices, 51(12), 2078-2085,
2004.
12. 09/5/07
ASME MEMS video:
Case Studies of Commercial Products
R.S. Payne,
vision,” The
42nd IEEE International Solid-State Circuits Conference (ISSCC 1995), 164-165,
358, San
Francisco, USA, 1995.
R.S. Payne, “MEMS
commercialization: ingredients for success,” The 13th International
Conference
on MEMS (IEEE MEMS 2000), pp.7-10,
13. 16/5/07
Robert D.
"Skip" Rung, Robert Beeson, “Thermal
Inkjet Technology - Review and Outlook,” The
3rd International Conference on Imaging Science
and Hardcopy, Chongqing, China, May 26-29,
1998.
F. Jiang et al.,
"Flexible
shear stress sensor skin for aerodynamics applications," IEEE MEMS
2000, Miyazaki, Japan,
pp.364-369, 2000.
A.
Bertsch, S. Jiguets, P. Bernhard, P. Renaud, “Microstereolithography:
a Review,” Mat. Res.
Soc. Symp. Proc., Vol. 758,
LL1.1.1-LL1.1.12.
Wenhui Zhou et al., “An Efficient
Two-Photon-Generated Photoacid Applied to Positive-Tone 3D Microfabrication,” Science,
296(5570) 1106-1109, 2002.
S. Kawata et al., “Finer features for
functional microdevices,” Nature,
412, 697-698, 2001.
Homeworks:
Homework#1 due: 14
Feb 2007, Note: NHK Nanospace
video can be found in HKUST library (v.3).
Homework#2 due: 7
Mar 2007, Ref: Varioptics Inc, France
Term
Project Proposal due: 4 Apr 2007. Description of the MESF 595 term project
References:
Dr. Daniel Bank’s
Microengineering Overviews
Gives short overviews of topics such as microengineering, photolithography,
silicon micromachining, mask design, microsystems, microsensors,
microactuators, and and microcomponent assembly and packaging
Introduction
to Microengineering Supplement by Dr. Daniel Banks
More information on microengineering including background, the effect of
microengineering on future business, applications for microengineering, and
microengineering technology
This site refers you to almost all sources of education about MEMS,
including research being done on MEMS by leading universities and national
laboratories and regional groups
Implications of Emerging Micro and Nanotechnology, by Air Force Science
and Technology Board, The National Academies Press, Washington DC, USA, 2002. free online, NetLibrary, Amazon
Books:
1. Fundamentals of Microfabrication: The Science of Miniaturization, 2nd
ed., Marc Madou, CRC
Press, 2002. ISBN: 0849308267
(TK7836 .M33, HKUST LIB)
2. Implications of Emerging Micro and Nanotechnology, by Air Force
Science and Technology
Board, The National Academies
Press,
3. Micromachined Transducers Sourcebook, Gregory T.A. Kovac,
McGraw-Hill, ISBN:
0072907223, 1998.
4. Semiconductor Sensors, S.M. Sze, John Wiley & Son, ISBN:
0471546097, 1994.
5. Microsystem Design, Stephen D. Senturia, Kluwer Academic Publishers,
ISBN:
0792372468, 2001.
6. Microsensors, Principles and Applications, Julian W. Gardner, John
Wiley & Son, Inc,
ISBN: 0471941352, 1994.
Magazines/Newsletter:
1. Micromachine Devices, R&D Magazine
2. MSTnews, VDI/VDE-Technologiezentrum,
3. SmallTimes, http://www.smalltimes.com
4. MEMS Clearinghouse, http://www.memsnet.org
subscribe MEMS mailing
list http://mail.mems-exchange.org
List of
Companies in the world involve MEMS R&D (from HKUST MECH597)
MEMS Glossary (from
Fundamentals of Microfabrication, CRC Press, 1997.)
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