NAMI-ICI: 01/10/07-30/09/10, Henkel, U.S.A.
Mold Compound/Die Attach Compatibility Study
RPC06/07.EG28: 30/06/07-29/06/09, Research Project Competition Grant (HKUST/UGC), Hong Kong.
Yellow Phosphor Coating and Glob-top Encapsulation of High Brightness Light Emitting Diode (HB-LED) Arrays Using Wafer Level Packaging Process
SMI06/07.EG01: 19/02/07-31/08/08, SUN Microsystems Inc., U.S.A.
Evaluation of Package and Board Level Solder Joint Reliability of Ceramic Ball Grid Array (CBGA) Packages under Ball Pull, Ball Shear, Mechanical Bending and Shock Loadings
AIT06/07.EG01: 01/02/07-30/06/08, Advanced Interconnect Technologies (Batam) Ltd., Indonesia.
Characterization of Board Level Solder Joint Reliability of Etched Leadless Packages (ELP)
AT06/07.EG01: 01/01/07-31/12/07, Agilent Technologies Inc., Malaysia.
Evaluation of Lead-free BGA Solder Joint Reliability under Temperature Cycling and Mechanical Drop Loading
00410E: 01/01/07-31/12/07, CLI Adaptation Project (HKUST/UGC), Hong Kong.
Production of Advanced Illustrative Animations of Finite Element Simulation for Teaching in Structural Mechanics and Stress Analysis Courses
GHP/028/05: 20/02/06-31/12/07, Innovation & Technology Commission (ITSP/ITC), Hong Kong.
Development and Dissemination of Advanced Lead-free Soldering Process Technologies for Green Electronics Manufacturing and Assembly
DAG05/06.EG34: 01/02/06-31/08/07, Direct Allocation Grant (DAG/RGC), Hong Kong.
System Design and Packaging of High Brightness Light Emitting Diode (HB-LED) Array Modules for Wide Area Interior Solid State Lighting to Replace Conventional Fluorescent Light Tubes
VTEL05/06.EG01: 16/01/06-30/06/07, VTech Co. Ltd., Hong Kong.
Evaluation of Board Level Reliability of Lead-free Solder Joints for Improvement of Lead-free Soldering Process
HUAWEI05/06.EG02: 12/11/05-31/08/07, Huawei Technologies Co. Ltd., China.
Characterization of Thermal Performance and Stress Analysis for Stacked-Die System-in-Package
MTR05/06.EG01: 01/09/05-30/06/08, Mass Transit Railway Corp., Hong Kong.
Packaging of High-Brightness Light Emitting Diode (HB-LED) Array Module for the Replacement of Saloon Lighting on MTR Subway Trains
HUAWEI05/06.EG01: 01/07/05-31/08/08, Huawei Technologies Co. Ltd., China.
Computational Simulation and Experimental Study for Board Level Solder Joint and Process Reliability
FTS05/06.EG01: 01/07/05-31/12/05, Flextronics International, U.S.A.
Determination of Fatigue Life Prediction Equation for PBGA-PCB Assembly with SAC Lead-free Solder Joints
PEHKL04/05.EG01: 16/06/05-31/03/06, Philips Semiconductors, Hong Kong.
Characterization of Intermetallic Compound Forming and Copper Diffusion of Copper Wire Bonding
UIM/160: 01/05/05-31/10/06, Innovation & Technology Commission (ITSP/ITC), Hong Kong.
Technology Development and Prototyping of MEMS-based Microphone
HKUST-1-AM: 01/01/05-31/12/05, CLI Adaptation Project (HKUST/UGC), Hong Kong.
Web-based Interactive Tool for Visualization of Structural Analysis with Finite Element Simulation
HUAWEI04/05.EG02: 01/11/04-30/06/05, Huawei Technologies Co. Ltd, China.
Mechanical Reliability Study on Lead-free Solder Joints
ZTE04/05.EG01: 11/10/04-31/03/06, ZTE Corp., China.
Experimental Investigation on the Reliability of Lead-free Solder Joints under Temperature Cycling and Mechanical Loading
FTS04/05.EG01: 01/09/04-28/02/05, Flextronics International, U.S.A.
Experimental Characterization of Thermal Fatigue Prediction Parameters of Lead-free Solder Joints under Isothermal Cyclic Loading
PD04/05.EG01: 01/08/04-30/04/05, Private Project, Taiwan.
Investigation on the Response of a Lead Projectile Subject to Inclined Impact with Live Muscle Tissues
HUAWEI04/05.EG01: 31/07/04-31/08/05, Huawei Technologies Co. Ltd, China.
Finite Element Modeling and Stress Analysis of Printed Circuit Board under Depaneling Loading Conditions
I2MS01/02.EG09: 01/07/03-30/06/04, Institute of Integrated Micro Systems Grant (HKUST/UGC), Hong Kong.
Development of Packaging Technologies for Micro-Opto-Electro-Mechanical Systems (MOEMS)
DAG02/03.EG49: 10/02/03-31/12/04, Direct Allocation Grant (DAG/RGC), Hong Kong.
Experimental Investigation on Solder Joint Integrity and Dynamic Response of Chip Scale Package-Printed Circuit Board Assemblies under Mechanical Shock Loading
HIA02/03.EG05: 09/12/02-08/12/04, High Impact Area Grant (HKUST/UGC), Hong Kong.
Establishment of Research Infrastructure for Optoelectronics Packaging Technologies
HKUST6231/01E:
01/09/01-31/08/03, Competitive Earmarked Research Grant (CERG/RGC), Hong
Kong.
Experimental Investigation and Computational Analysis on the Solder Ball Shear and Pull Testing Conditions for Ball Grid Array and Flip Chip Packages
HKUST6078/00E:
01/09/00-31/08/02, Competitive Earmarked Research Grant (CERG/RGC), Hong
Kong.
Assessment on the Effects of Electroless Nickel Plating on the Reliability of Solder Ball Attachment to the Bond Pads of Plastic Ball Grid Array Substrate
AIT00/01.EG01: 01/07/00-30/06/02,
Advanced Interconnect Technologies (HK) Ltd
Board Level Reliability of PBGA Assemblies with Pb-free Solders
DAG99/00.EG34: 01/01/00-31/12/00, Direct Allocation Grant (DAG/RGC), Hong Kong.
A Pilot Study on the Development of a Damage Evolution Model for the Computational Analysis of Solder Joint Reliability
HKUST6047/99E:
01/08/99-31/07/01, Competitive Earmarked Research Grant (CERG/RGC), Hong
Kong.
Experimental Investigation on the Strain-Rate Dependent Mechanical Behaviors of Solder Materials under Impulsive Shear Loading
HKUST6024/98E: 01/09/98-31/08/00, Competitive Earmarked Research Grant (CERG/RGC), Hong Kong.
Characterization and Analysis of Thermal Creep Fatigue Behaviors of Solder Joints in Plastic Ball Grid Array Assembly
G-HK97/98.EG01:
01/01/98-31/12/98, German Academic Exchange Service (DAAD), Germany.
Improvement of Performance for a Rotary Motor Driven by Anisotropic Piezoelectric Composite Laminate
ACL96/97.EG01: 01/10/97-31/03/01, Advanced Component Laboratories (HK) Ltd., Hong Kong.
Material and Process Characterization for Wire-Bond Pad of PBGA Substrate and Dimensional Stability of Multi-Layer PCB
RH97107: 01/09/97-29/02/00, Chiang
Industrial Charity Foundation, Hong Kong.
Development of a Rotary Motor Driven by Anisotropic Piezoelectric Laminates
DAG96/97.EG16: 01/10/96-30/09/97, Direct Allocation Grant (DAG/RGC), Hong Kong.
Innovative Design and Analysis of Smart Composites for Piezoelectric Actuators
RI94/95.EG13:
01/01/96-31/12/98, Research Infrastructure Grant (RIG/UGC), Hong Kong.
Development of Innovative Design and Processing of Composite Grid Structures for Infrastructural Constructions and Repairs
CPDG94/95.EG03:
01/06/95-31/05/96, Hong Kong University of Science & Technology
(HKUST/UGC), Hong Kong.
Innovative Composite Design for the Applications in Transportation Systems and Infrastructure
HKUST569/94E:
01/01/95-31/12/97, Competitive Earmarked Research Grant (CERG/RGC), Hong
Kong.
Bonded Repairs of Damaged Structures Using Composite Patch
DAG93/94.EG10: 01/03/94-30/06/95, Direct Allocation Grant (DAG/RGC), Hong Kong.
Bending/Twisting/Shearing Actuation & Sensing of Composite Laminates with Embedded Piezopolymer Film